Article exhibiting enhanced adhesion between a dielectric substrate and heat spreader and method
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United States of America Patent
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Mar 4, 2003
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N/A
app pub date -
Oct 13, 1998
filing date -
Oct 13, 1998
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Abstract
Providing a layer of ZnCr intermediate a dielectric substrate and a heat spreader enhances the adhesion between the dielectric substrate and heat spreader.
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