Method for making a probe apparatus for testing integrated circuits

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6530148
SERIAL NO

09579718

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a method for sanding heads of buckling beam probes while the probes are disposed within a probe assembly between a lower die and upper die. Sanding provides that all the probes within a probe assembly have the same total length from tip to head. The method calls for contacting the probe tips to a flat fiducial plate such as a glass plate to ensure that the probe tips are coplanar. Then, the heads are sanded to a plane which is parallel with the fiducial plate. Preferably, the heads are sanded by placing the assembly and fiducial plate onto a Z-stage capable of moving in a Z direction. The Z-stage is located under a top surface of a table having a hole directly above the Z-stage. Raising the Z-stage lifts the probe heads to extend above the top surface of the table. Then, an abrasive plate resting on the top surface of the table is rubbed on the heads. Material is removed from the heads until all the probes are the same length. Probe assemblies made according to the present invention have probe heads with characteristic sanded top surfaces and the probes have the same length, generally to within 0.0001 inches.

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Patent Owner(s)

  • KULICKE AND SOFFA INVESTMENTS, INC.;SV PROBE PTE LTD.;PROBE TECHNOLOGY, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kister, January Redwood City, CA 70 2036

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