Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing
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United States of America Patent
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Mar 11, 2003
Issued Date -
N/A
app pub date -
Oct 18, 1999
filing date -
Aug 15, 1997
priority date (Note) -
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Abstract
A platform for supporting a semiconductor substrate during processing in a processing chamber includes a body having a first support surface for supporting the substrate thereon and a second support surface for being supported by a rotatable housing over a heater in the processing chamber. The body comprises a quartz material, with at least a portion of the quartz material being adapted to be opaque to block transmission of photon energy through that portion during heating. For example, the quartz material may include a coating over at least a portion of the quartz material, with the coating adapting the quartz material to be opaque. In preferred form, the coating comprises a composite film of silicon and silicon carbide.
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