Surface micromachining using a thick release process
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United States of America Patent
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Mar 11, 2003
Grant Date -
N/A
app pub date -
Jan 10, 2001
filing date -
Jan 10, 2001
priority date (Note) -
Expired
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Abstract
A hybrid process combines a thin-film surface micromachining process such as by sputtering, evaporation or chemical vapor deposition with a thick-film surface micromachining and release process such as dry-film lamination. Such combination results in thin film micro-structures with all the benefits of surface micromachining without the typical problems of stiction and limited range of motion.
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