Importance

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Abstract

An electrical connection for a surface-mount circuit device, and a method for forming the electrical connection. The electrical connection includes a solder stop that promotes the accurate location of a solder joint that electrically connects the surface-mount device to the conductor. In accordance with the invention, the solder stop also promotes stress relief of the electrical connection during thermal cycling, such that thermal cycle fatigue cracking occurs in the solder stop instead of the conductor and solder joint. As a result, thermal stresses are absorbed and dissipated by the solder stop, and do not adversely affect the continuity and mechanical integrity of the electrical connection. The solder stop preferably has a composition that contains an inorganic particulate filler in a glass matrix, the latter being present in an amount that forms a weak bond between the inorganic particles and between the solder stop and conductor.

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First Claim