Integrated impedance matching and stability network
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United States of America Patent
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Mar 11, 2003
Grant Date -
Jan 23, 2003
app pub date -
Jul 17, 2001
filing date -
Jul 17, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit for intermediate impedance matching and stabilization of high power devices is disclosed. High quality epitaxial layers of monocrystalline materials grown over monocrystalline substrates enables the formation of impedance matching and stability circuits to be placed on the same substrate as the active device. Additionally, by using the manifolds of the active to form plates of a capacitor, an impedance matching network of series inductance and shunt capacitor can be compactly fabricated for increasing the output impedance to intermediate levels. The manifolds of the active device are also used to form capacitors to provide stability to high power active devices.
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