Interdigitated capacitor design for integrated circuit lead frames and method
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United States of America Patent
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Mar 11, 2003
Grant Date -
Jun 20, 2002
app pub date -
Feb 5, 2002
filing date -
Apr 1, 1998
priority date (Note) -
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Abstract
A semiconductor device includes a two-part, coplanar, interdigitated decoupling capacitor formed as a part of the conductive lead frame. For down-bonded dice, the die attach paddle is formed as the interdigitated member. Alternatively, an interdigitated capacitor may be placed as a LOC type lead frame member between electrical bond pads on the die. The capacitor sections comprise Vcc and Vss bus bars.
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