Reference plane of integrated circuit packages
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 11, 2003
Grant Date -
Nov 28, 2002
app pub date -
May 26, 2001
filing date -
May 26, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus including an integrated circuit including a plurality of devices and signal circuitry coupled to the plurality of devices, and a package substrate including a first surface coupled to the integrated circuit, a second surface having a plurality of externally accessible contact points coupled to the signal circuitry, and a continuous layer of conductive material coupled to a reference signal of the integrated circuit and disposed over an area of the second surface and electrically isolated from the contact points.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully