Integral card and method of making
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 18, 2003
Grant Date -
N/A
app pub date -
Jun 14, 2000
filing date -
Jun 14, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A business form incorporates an improved multi-layer integral card utilizing microperforations to form ties which retain the card during machine handling and printing. The method employs a flexible steel die or engraved die cylinder with microperforations. The die penetrates all layers but the bottom laminate and the microperforations form ties to secure the card until removed for use. The combination and method of forming allows convenient removal of the card by an end user with edges on the removed card being smooth to sight and touch.
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Family
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Cited Art Landscape
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