Device for handling wafers in microelectronic manufacturing
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United States of America Patent
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-
Mar 18, 2003
Grant Date -
N/A
app pub date -
Dec 29, 1998
filing date -
Dec 29, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A wafer handling device includes a platform having a plurality of movable grippers. A driver is mounted on the platform and selectively couples to at least one of the plurality of grippers to selectively move at least one of the plurality of grippers with regard to the platform. The driver may be magnetically coupled to at least one gripper to move it between a first proximal position and a first distal position. The driver may be mounted on the platform with a track assembly that effectuates a linear magnetic propulsion field to move the driver between the first axial position and the second axial position.
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