Method for treating carbon film, carbon film and component with carbon film
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United States of America Patent
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Mar 18, 2003
Grant Date -
N/A
app pub date -
Feb 14, 2001
filing date -
Jun 18, 1999
priority date (Note) -
Expired
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Abstract
A method for treating a carbon film comprising, in sequence, depositing a carbon film onto a substrate by a plasma CVD technique and exposing the carbon film at its surface to a gas plasma produced utilizing at least one type of gas selected from an Ar gas, N.sub.2 gas, H.sub.2 gas and F-containing gas so that the carbon film surface is modified.
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