Method for molding semiconductor package having a ceramic substrate
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United States of America Patent
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Mar 18, 2003
Grant Date -
N/A
app pub date -
Jun 29, 2001
filing date -
Jun 29, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A method for overmolding a ceramic substrate for a semiconductor chip or other electrical device, and a resulting package, are disclosed. In one embodiment, plural ceramic substrate panels having a matrix of semiconductor chips thereon are precisely located on and attached to a temporary support member using an alignment tool. The member and the attached ceramic substrate panels are then placed in a mold tool. When the mold tool is closed, it clamps down on the member around the ceramic substrate panel, and not on the ceramic substrate panel itself. A mold compound injected into the mold tool encapsulates the chips and ceramic substrate panels. Subsequently, packages each containing a chip are singulated from the encapsulated ceramic substrate panels.
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