Glass and glass tube for encapsulating semiconductors
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United States of America Patent
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-
Mar 18, 2003
Grant Date -
Jan 3, 2002
app pub date -
May 14, 2001
filing date -
May 16, 2000
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Glass, for encapsulating a semiconductor, which is substantially free of lead or other harmful ingredients, but which exhibits a sealing temperature of not higher than 710.degree. C., and which stably seals with Dumet. Further, when the glass has a viscosity of 10.sup.6 dPa.multidot.s, the temperature of said glass is not higher than 710.degree. C., and includes two or more of Li.sub.2 O, Na.sub.2 O and K.sub.2 O and B.sub.2 O.sub.3. Also, the glass may comprise: SiO.sub.2, B.sub.2 O.sub.3 and Al.sub.2 O.sub.3 in an amount of from 40 to 70%, from 5 to 20% and from 0 to 15% by weight, respectively; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; and Li.sub.2 O, Na.sub.2 O and K.sub.2 O in a total amount of from 5 to 25% by weight.
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