METHODS OF MAKING MICROELECTRONIC ASSEMBLIES USING BONDING STAGE AND BONDING STAGE THEREFOR
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United States of America Patent
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Mar 18, 2003
Grant Date -
Mar 20, 2003
app pub date -
Sep 14, 2001
filing date -
Sep 14, 2001
priority date (Note) -
Granted
status (Latency Note)
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Abstract
A method of making a microelectronic assembly comprises connecting a lead to a contact on a microelectronic element and to a stage. The microelectronic element is juxtaposed with a microelectronic component and the lead is disconnected from the stage. The lead is bonded to a terminal pad on the microelectronic component. A stage for making a microelectronic assembly has a conduit for introducing a bonding tool toward a lead bonded to the stage and extending across the conduit while the microelectronic element is juxtaposed with the microelectronic component.
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