Resistor trimming with small uniform spot from solid-state UV laser
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United States of America Patent
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Mar 18, 2003
Grant Date -
Aug 1, 2002
app pub date -
Jan 31, 2002
filing date -
Feb 1, 2001
priority date (Note) -
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Abstract
A uniform laser spot, such as from an imaged shaped Gaussian output (118) or a clipped Gaussian spot, that is less than 20 .mu.m in diameter can be employed for both thin and thick film resistor trimming to substantially reduce microcracking. These spots can be generated in an ablative, nonthermal, UV laser wavelength to reduce the HAZ and/or shift in TCR.
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