Substrate processing system and substrate processing method
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United States of America Patent
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-
Mar 25, 2003
Grant Date -
N/A
app pub date -
Aug 31, 2000
filing date -
Sep 3, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In an FAB having a plurality of coating and developing processing apparatus, atmospheric pressure is measured by a barometer provided in the FAB, and a measured value is sent to each of the coating and developing processing apparatus via a host computer. In each coating and developing processing apparatus, based on the value, the rotation speed of a substrate in a resist solution coating unit is regulated only when the atmospheric pressure value exceeds a predetermined allowable value which is preset according to the type of chemical. As a result, without causing the complication of the apparatus, plant and equipment investment can be held to minimum, and the coating film thickness of a substrate can be maintained at a predetermined thickness.
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