Method and apparatus for transferring and supporting a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Mar 25, 2003
Grant Date -
N/A
app pub date -
Jul 31, 2000
filing date -
Mar 10, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system. In one aspect, a support ring having one or more substrate support members mounted thereon and defining a central opening therein for receipt of a substrate support member during processing is disclosed. In another aspect, a substrate handler blade having a plurality of substrate supports disposed thereon is provided which is adapted to support a substrate thereon and effectuate substrate transfer between the substrate handler blade and the support ring.
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