Removing apparatus for molded products

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6537055
APP PUB NO 20020105104A1
SERIAL NO

09848045

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides a removing apparatus for molded products and a method for cutting off gates of molded products, by which various types of molded products having different gate positions from each other are cut off to separate the product parts from runners with high accuracy by using a single cutting member and which contributes to downsizing of the apparatus itself. The invention further provides a removing apparatus for molded products and a method for cutting off gates of molded products, by which work for attaching the cutting unit is simplified and work for removing is made very efficient. In addition, the invention provides a removing apparatus for molded products and a method for cutting off gates of molded products, in which gates of various types of molded parts are cut off and separated from product parts by a single cutting member, wherein a chuck unit, which has a plurality of product parts at a runner and holds molded products, is controlled and moved between a metal mold position of a molding machine and a release position outside the metal mold in order to pick up molded products, a cutting unit having a cutting member that cuts off the gates of molded products by opening and closing a pair of cutting blades is provided at the release position side, and the cutting member is controlled and turned by an electric motor to cause the blades to be positioned at the gate position of respective product parts in the molded products held by the chuck unit for cutting off and separation.

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Patent Owner(s)

Patent OwnerAddress
STAR SEIKI CO LTDMIZUHO-KU NAGOYA-SHI AICHI

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adachi, Isao Nagoya, JP 20 184

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