Apparatus and method for packaging circuits

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6537100
APP PUB NO 20020182926A1
SERIAL NO

10196103

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention relates to a circuit package comprising a module and a socket which cooperate to provide quick and easy insertion of the module into the socket using a small insertion force, accurate alignment between the module and the socket after insertion, and coupling between a module coupling site and a socket coupling site after insertion. A socket guide feature allows an edge of the module to slide along the guide feature during insertion of the module into the socket, and a module alignment feature interlocks with a socket alignment feature after insertion of the module into the socket. In addition, after insertion of the module into the socket, a retaining feature restricts the motion of the module so that the module coupling site remains in contact with the socket coupling site.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT100 WALL STREET SUITE 1600 NEW YORK NY 10005

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Moden, Walter L Meridian, ID 194 4970

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