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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT	100 WALL STREET SUITE 1600 NEW YORK NY 10005

International Classification(s)

• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

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• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Cobbley, Chad A	Boise, ID	127	2264
Fogal, Rich	Boise, ID	69	1958
VanNortwick, John	Kuna, ID	36	200

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent No: 6537400

Automated method of attaching flip chip devices to a substrate

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