Methods for fabricating protective structures for bond wires
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United States of America Patent
Stats
-
Mar 25, 2003
Issued Date -
N/A
app pub date -
Aug 30, 2001
filing date -
Jun 8, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for fabricating a protective structure for bond wires of a semiconductor device assembly which includes sequentially fabricating one or more layers of the protective structure. After a first layer is formed, each subsequent layer is superimposed upon, contiguous with, and mutually adhered to an underlying layer of the protective structure. Such structure may be used to protect the bond wires of a test apparatus, which connect the contact pads of a carrier substrate of the test apparatus to corresponding bond pads of a test substrate. In addition, a fence member may be assembled with or formed on the test substrate to align and receive a semiconductor device and, thereby, to facilitate assembly of the semiconductor device with the test substrate. The fence member can be formed integrally with the protective structures or secured over the protective structures. Stereolithographic processes may be used to fabricate the fence member.
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