Method of connecting a bumped compliant conductive trace to a semiconductor chip
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United States of America Patent
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-
Mar 25, 2003
Issued Date -
N/A
app pub date -
Jul 27, 2001
filing date -
Oct 13, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a base, wherein the chip includes a conductive pad, the conductive trace includes a bumped terminal, the base includes a recess, the conductive trace is disposed proximate to the pad, the base contacts and covers the conductive trace on a side opposite the chip, the bumped terminal is in the recess, and the conductive trace and the base are different metals, etching the base to expose the conductive trace, and forming a connection joint that contacts and electrically connects the conductive trace and the pad. Preferably, the bumped terminal is outside a periphery of the chip, and an encapsulant provides compressible mechanical support for the bumped terminal.
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