Strain relief structures for lead connections
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United States of America Patent
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Mar 25, 2003
Grant Date -
N/A
app pub date -
Jan 18, 2002
filing date -
Jan 18, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flex circuit system has a support member on which a first subsystem of the flex circuit system is mounted. A second subsystem of the flex circuit system is remote from the first subsystem. A lead is bonded to bonding points on the first and second subsystems and woven through apertures in the support member to secure the lead in relation to the first subsystem and minimize the tension and bending loads seen at the bonding points of the first subsystem.
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