Multi-layer circuits and methods of manufacture thereof
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United States of America Patent
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Mar 25, 2003
Grant Date -
Jun 20, 2002
app pub date -
Dec 13, 2001
filing date -
Aug 15, 2000
priority date (Note) -
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Abstract
A multi-layer circuit comprises a circuit and a resin covered conductive layer disposed on the circuit, wherein the resin covered conductive layer comprises a liquid crystalline polymer resin laminated to a conductive layer. Such multi-layer circuits are particularly useful for high density circuit applications.
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