Semiconductor reliability test chip
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United States of America Patent
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Mar 25, 2003
Grant Date -
Feb 28, 2002
app pub date -
Aug 28, 2001
filing date -
Nov 17, 1995
priority date (Note) -
Expired
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Abstract
A semiconductor test chip including a plurality of test functions. The test functions of the semiconductor test chip include bond pad pitch and size effects on chip design, wire bond placement accuracy regarding placement of the wire bond on the bond pad, evaluation of bond pad damage (cratering) effect on the area of the chip below the bond pad during bonding of the wire on the bond pad, street width effects regarding the use of thinner saw cuts in cutting the individual chips from the wafer, thermal impedance effects for thermal testing capabilities, ion mobility evaluation capabilities and chip on board in flip chip application test capabilities.
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