Semiconductor device and method of manufacturing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Mar 25, 2003
Grant Date -
Jun 7, 2001
app pub date -
Dec 20, 2000
filing date -
Jun 4, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device has (a) a semiconductor component; (b) a circuit substrate; (c) a base material which is placed between the semiconductor component and the circuit substrate; and (d) a conductive paste, which is filled into a hole formed in the base material, for electrically connecting between a terminal electrode of the semiconductor component and an internal connection electrode of the circuit substrate.
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