High density flip chip memory arrays
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United States of America Patent
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Mar 25, 2003
Grant Date -
Oct 18, 2001
app pub date -
Jun 15, 2001
filing date -
Mar 25, 1998
priority date (Note) -
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Abstract
A low alpha emissivity-induced error solder bump, flip-chip integrated circuit device. The device includes a semiconductor die having an active surface and a bond pad array disposed about the active surface of the die. The active surface of the die includes logic circuits adjacent memory cell arrays. Each of the bond pads directly overlays a logic circuit, to which they may be connected. The present invention also includes methods for designing and fabricating the invented devices and connecting them to a carrier substrate.
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