High frequency printed circuit board via
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 25, 2003
Grant Date -
Sep 19, 2002
app pub date -
Jan 16, 2001
filing date -
Feb 25, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board (PCB) via, providing a conductor extending vertically between microstrip or stripline conductors formed on separate layers of a PCB, includes a conductive pad surrounding the conductor and embedded within the PCB between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via.
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