Semiconductor die with contoured bottom surface and method for making same
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United States of America Patent
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Apr 1, 2003
Grant Date -
Jan 30, 2003
app pub date -
Jul 27, 2001
filing date -
Jul 27, 2001
priority date (Note) -
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Abstract
Methods are disclosed for manufacturing semiconductor device dies and for removing material from the bottom side of the wafer dies, wherein a contoured surface is provided on the die bottom, such as through an etching process. In addition, methods are disclosed for securing a semiconductor device to a surface. Semiconductor wafers and die are also disclosed having contoured bottom surfaces.
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