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Abstract

An arrangement for planarizing a surface of a semiconductor wafer. The arrangement includes a planarizing member having a planarizing surface configured to be (i) positioned in contact with and (ii) moved relative to the surface of the semiconductor wafer so as to remove material from the surface of the semiconductor wafer such that the surface of the semiconductor wafer is planarized. The arrangement also includes an adherence promoting ligand chemically bonded to the planarizing surface of the planarizing member. The arrangement further includes an abrasion particle chemically bonded to the adherence promoting ligand such that the abrasion particle is attached to the planarizing surface of the planarizing member. The arrangement also includes a conditioning bar having a conditioning portion positioned in contact with a wafer track defined on the planarizing member. The conditioning portion is configured so that the conditioning portion extends completely across the wafer track. The arrangement still further includes a wafer carrier which (i) urges the surface of the semiconductor wafer against the planarizing surface at a first pressure for a first period of time and (ii) urges the surface of the semiconductor wafer against the planarizing surface at a second pressure for a second period of time. The first pressure is greater than the second pressure such that slurry is advanced from an outer periphery of the semiconductor wafer toward a center portion of the semiconductor wafer. An associated method of planarizing a surface of a semiconductor wafer is also disclosed.

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