Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates
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United States of America Patent
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Apr 1, 2003
Issued Date -
N/A
app pub date -
Jan 16, 2001
filing date -
Jan 25, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A laser via drilling system, and a method of use thereof, is provided. The apparatus uses two or more laser systems to achieve processing parameter flexibility. The output beams from the independently controlled laser systems are combined using a beam splitter that combines the beams into single or multiple processing beams. The operational flexibility of the system can be further enhanced through the use of multiple EO modulators and a polarization sensitive beam splitter.
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