Framed sheets
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United States of America Patent
Stats
-
Apr 1, 2003
Grant Date -
Dec 13, 2001
app pub date -
Feb 12, 2001
filing date -
Jul 7, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microelectronic component is fabricated by bonding a flexible sheet in tension on a rigid frame so that the sheet spans an aperture in the frame, and performing one or more operations on features on the flexible sheet which will be incorporated into the finished component. The frame maintains dimensional stability of the sheet and aids in regsitration of the sheet with external elements such as processing tools or other parts which are to be assembled with the sheet. Desirably, the frame has a coefficient of thermal expansion different from that of the sheet so that when the sheet is brought from the bonding temperature to the temperature used in processing, differential thermal expansion or contraction will cause increased tension in the sheet.
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