Porous dielectric material and electronic devices fabricated therewith
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United States of America Patent
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Apr 1, 2003
Grant Date -
Nov 15, 2001
app pub date -
Jun 26, 2001
filing date -
Nov 16, 1999
priority date (Note) -
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Abstract
A novel dielectric composition is provided that is useful in the manufacture of electronic devices such as integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by crosslinking a thermally decomposable porogen to a host polymer via a coupling agent, followed by heating to a temperature suitable to decompose the porogen. The porous materials that result have dielectric constants less than about 3.0, with some materials having dielectric constants less than about 2.5. Integrated circuit devices, integrated circuit packaging devices, and methods of manufacture are provided as well.
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