Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 1, 2003
Grant Date -
N/A
app pub date -
Mar 1, 1999
filing date -
Mar 1, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices are described. In one embodiment, a microelectronic device includes a microelectronic package which provides a housing within which integrated circuitry is received. An integrated circuit die is received within the microelectronic package and includes integrated circuitry formed thereon. The integrated circuitry comprises first transmit/receive circuitry configured to transmit and receive radio frequency signals.
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