Microelectronic joining processes with temporary securement
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 8, 2003
Grant Date -
N/A
app pub date -
Mar 10, 2000
filing date -
Mar 10, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of making microelectronic assemblies includes temporarily securing one or more microelectronic elements in place on one or more components using one or more temporary securements extending between the microelectronic elements and components and adhering to the elements and components. Conductive features of the elements are connected to conductive features of the components and the temporary securements are released.
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