US Patent No: 6,543,512

Number of patents in Portfolio can not be more than 2000

Carrier, method and system for handling semiconductor components

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Importance

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Abstract

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A carrier for semiconductor components, and a method and system for handling semiconductor components using the carrier, are provided. The carrier includes a frame having component mounting sites that include adhesive members for retaining the components on the carrier. The adhesive members can include one or more pieces of polymer tape having low tack adhesive surfaces for retaining the components, and high tack adhesive surfaces for bonding to the carrier. The low tack adhesive surfaces are formulated to provide adhesive forces sufficient to retain the components on the component mounting sites, but low enough to allow a conventional pick and place vacuum tool to remove the components from the carrier. The adhesive forces on the components are determined by a contact area between the components and low tack adhesive surfaces, and by adhesive qualities of the low tack adhesive surfaces.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID21574

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hamren, Steven L Boise, ID 27 326

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Minnesota Mining and Manufacturing Company (4)
5,141,790 Repositionable pressure-sensitive adhesive tape 161 1989
5,389,438 Repositionable adhesive tape 54 1991
5,378,536 Repositionable adhesive tape 36 1992
5,629,063 Repositionable tape closure system for a thin film article 30 1995
 
AMKOR TECHNOLOGY, INC. (2)
5,852,870 Method of making grid array assembly 29 1996
5,985,695 Method of making a molded flex circuit ball grid array 78 1998
 
MICRON TECHNOLOGY, INC. (2)
6,136,137 System and method for dicing semiconductor components 32 1998
6,319,354 System and method for dicing semiconductor components 18 2000
 
3M INNOVATIVE PROPERTIES COMPANY (1)
6,235,387 Semiconductor wafer processing tapes 16 1998
 
ADVANTEK, INC. (1)
5,152,393 Microchip storage tape 24 1991
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,476,566 Method for thinning a semiconductor wafer 79 1994
 
GEL-PAK, LLC (1)
5,769,237 Tape carrier for electronic and electrical parts 17 1996
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
6,054,008 Process for adhesively attaching a temporary lid to a microelectronic package 11 1998
 
MACSEMA, INC. (1)
5,576,936 Compact electronic data module with nonvolatile memory 6 1995
 
MULTEK FLEXIBLE CIRCUITS, INC. (1)
5,727,310 Method of manufacturing a multilayer electronic circuit 40 1996
 
MURATA MANUFACTURING CO., LTD. (1)
5,534,102 Component supply method 47 1994
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
5,620,928 Ultra thin ball grid array using a flex tape or printed wiring board substrate and method 73 1995
 
TDK CORPORATION (1)
5,089,314 Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series 18 1990
 
TEMPO G (1)
6,357,594 Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes 13 1998
 
TEXAS INSTRUMENTS INCORPORATED (1)
5,622,900 Wafer-like processing after sawing DMDs 37 1995
 
Other [Check patent profile for assignment information] (2)
5,667,073 Carrier tape for storage use of electronic components 15 1996
5,696,032 Tape application platform and processes therefor 19 1996

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
GEM SERVICES, INC. (4)
D492266 Portion of a matrix for surface mount package leadframe 2 2002
D513608 Portion of a matrix for surface mount package leadframe 4 2003
D488136 Portion of a matrix for surface mount package leadframe 4 2003
D487431 Portion of a matrix for surface mount package leadframe 4 2003
 
MICRON TECHNOLOGY, INC. (4)
6,853,064 Semiconductor component having stacked, encapsulated dice 39 2003
7,008,822 Method for fabricating semiconductor component having stacked, encapsulated dice 16 2003
7,109,576 Semiconductor component having encapsulated die stack 26 2004
7,227,252 Semiconductor component having stacked, encapsulated dice and method of fabrication 10 2005

Maintenance Fees

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 8, 2014
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Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00