Carrier, method and system for handling semiconductor components

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6543512
SERIAL NO

09181789

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A carrier for semiconductor components, and a method and system for handling semiconductor components using the carrier, are provided. The carrier includes a frame having component mounting sites that include adhesive members for retaining the components on the carrier. The adhesive members can include one or more pieces of polymer tape having low tack adhesive surfaces for retaining the components, and high tack adhesive surfaces for bonding to the carrier. The low tack adhesive surfaces are formulated to provide adhesive forces sufficient to retain the components on the component mounting sites, but low enough to allow a conventional pick and place vacuum tool to remove the components from the carrier. The adhesive forces on the components are determined by a contact area between the components and low tack adhesive surfaces, and by adhesive qualities of the low tack adhesive surfaces.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID18964

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hamren, Steven L Boise, ID 24 376

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 6054008 Process for adhesively attaching a temporary lid to a microelectronic package 12 1998
 
Minnesota Mining and Manufacturing Company (4)
5141790 Repositionable pressure-sensitive adhesive tape 170 1989
5389438 Repositionable adhesive tape 56 1991
5378536 Repositionable adhesive tape 36 1992
5629063 Repositionable tape closure system for a thin film article 37 1995
 
Other [Check patent profile for assignment information] (2)
* 5667073 Carrier tape for storage use of electronic components 15 1996
5696032 Tape application platform and processes therefor 19 1996
 
ADVANTEK, INC. (2)
* 5152393 Microchip storage tape 24 1991
* 6357594 Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes 15 1998
 
3M INNOVATIVE PROPERTIES COMPANY (1)
6235387 Semiconductor wafer processing tapes 18 1998
 
MICRON TECHNOLOGY, INC. (2)
6136137 System and method for dicing semiconductor components 36 1998
6319354 System and method for dicing semiconductor components 20 2000
 
MacSema, Inc. (1)
* 5576936 Compact electronic data module with nonvolatile memory 6 1995
 
TDK CORPORATION (1)
* 5089314 Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series 18 1990
 
MULTEK FLEXIBLE CIRCUITS, INC. (1)
5727310 Method of manufacturing a multilayer electronic circuit 41 1996
 
MURATA MANUFACTURING CO., LTD. (1)
* 5534102 Component supply method 64 1994
 
APPLE INC. (1)
* 5476566 Method for thinning a semiconductor wafer 84 1994
 
National Semiconductor Corporation (1)
* 5620928 Ultra thin ball grid array using a flex tape or printed wiring board substrate and method 76 1995
 
AMKOR TECHNOLOGY, INC. (2)
* 5852870 Method of making grid array assembly 30 1996
* 5985695 Method of making a molded flex circuit ball grid array 84 1998
 
TEXAS INSTRUMENTS INCORPORATED (1)
* 5622900 Wafer-like processing after sawing DMDs 40 1995
 
GEL-PAK, LLC (1)
* 5769237 Tape carrier for electronic and electrical parts 17 1996
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
U.S. BANK NATIONAL ASSOCIATION (1)
* 2004/0229,401 Method for fabricating semiconductor component having stacked, encapsulated dice 2 2003
 
MICRON TECHNOLOGY, INC. (5)
6853064 Semiconductor component having stacked, encapsulated dice 43 2003
* 2004/0227,250 SEMICONDUCTOR COMPONENT HAVING STACKED, ENCAPSULATED DICE 5 2003
7008822 Method for fabricating semiconductor component having stacked, encapsulated dice 27 2003
7109576 Semiconductor component having encapsulated die stack 26 2004
7227252 Semiconductor component having stacked, encapsulated dice and method of fabrication 12 2005
 
GEM Services, Inc. (4)
D492266 Portion of a matrix for surface mount package leadframe 3 2002
D513608 Portion of a matrix for surface mount package leadframe 4 2003
D488136 Portion of a matrix for surface mount package leadframe 5 2003
D487431 Portion of a matrix for surface mount package leadframe 5 2003
 
SAMSUNG ELECTRO-MECHANICS CO., LTD. (1)
* 2011/0048,786 PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING THE SAME 0 2010
* Cited By Examiner