Inkjet printhead assembly having planarized mounting layer for printhead dies
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United States of America Patent
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-
Apr 8, 2003
Grant Date -
N/A
app pub date -
Aug 25, 2000
filing date -
Aug 25, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.
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