Composition and method of formation and use therefor in chemical-mechanical polishing
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United States of America Patent
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Apr 8, 2003
Grant Date -
Dec 12, 2002
app pub date -
Jun 11, 2002
filing date -
Feb 16, 1999
priority date (Note) -
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Abstract
A composition and method of construction and use therefor in chemical-mechanical polishing ('CMP') of one or more substrate assemblies is described. More particularly, a polishing solution comprising etchant, abrasive particles, and surfactant and methods of mixing to form and to dispense the polishing solution are described. One or more of the etchant, abrasive particles, and/or surfactant may comprise a liquid medium. Etchant, surfactant or abrasive particles may be premixed, mixed in-situ ('point of use mixing'), or any combination thereof. The surfactant may be ionic or nonionic. In particular, a polyoxyethylene may be used, and more particularly, a polyoxyethylene ester or ether may be used.
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