Method for determining the concentration of contamination on a component
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United States of America Patent
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-
Apr 8, 2003
Grant Date -
Aug 16, 2001
app pub date -
Apr 17, 2001
filing date -
Nov 26, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Methods for determining the location of a droplet of water placed on a surface of a semiconductor wafer and for determining the concentration of contamination on a semiconductor wafer surface. One method includes placing a droplet of liquid on the semiconductor wafer surface and generating reference indicia indicative of a location of the droplet on the surface. Another method includes establishing first and second reference axes that intersect at a point and superimposing the point over a droplet of water on the semiconductor wafer surface. A first reference coordinate indicative of the position of the point along the first axis and a second reference coordinate indicative of the position of the point along the second axis are generated.
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