Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
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United States of America Patent
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Apr 8, 2003
Issued Date -
N/A
app pub date -
Jun 11, 2001
filing date -
Oct 2, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing a semiconductor chip assembly includes providing a semiconductor chip and a conductive metal, wherein the chip includes a conductive pad and the conductive metal includes routing line that is disposed above and overlaps the pad, etching the conductive metal on a side opposite the routing line to expose the routing line, and forming a connection joint that contacts and electrically connects the routing line and the pad.
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