Particle distribution method and resulting structure for a layer transfer process
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United States of America Patent
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Apr 8, 2003
Grant Date -
N/A
app pub date -
Jan 14, 2000
filing date -
Jan 14, 2000
priority date (Note) -
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Abstract
A method of forming substrates. The method includes providing a donor substrate; and forming a particle accumulation region at a selected depth in the donor substrate. The method includes diffusing a plurality of particles into the particle accumulation region to add stress to the particle accumulation region; and separating a thickness of material above the selected depth in the donor substrate.
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