Lightweight ready-mix joint compound

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United States of America Patent

PATENT NO 6545066
SERIAL NO

09724736

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The joint compound of the present invention utilizes hollow resin microspheres with a mean particle size less than 75 microns and exhibiting no more than 1.5% increase in density under high shear stress testing.

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Patent Owner(s)

Patent OwnerAddress
USG CORPORATION101 SOUTH WAKCER DRIVE CHICAGO IL 60606

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cimaglio, Scott A Gurnee, IL 1 39
Immordino, Jr Salvatore C Trevor, WI 7 228
Miller, Charles J McHenry, IL 28 619
Pickles, David Langley, CA 2 44

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