Printed wiring board interposer sub-assembly
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United States of America Patent
Stats
-
Apr 8, 2003
Grant Date -
Dec 5, 2002
app pub date -
May 31, 2001
filing date -
May 31, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
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