Enhanced leadless chip carrier
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United States of America Patent
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-
Apr 8, 2003
Grant Date -
Sep 12, 2002
app pub date -
Mar 6, 2001
filing date -
Mar 6, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A plastic integrated circuit package includes a lead frame having numerous leads, a die attach pad and a ground ring. In one embodiment, the plastic integrated circuit package is provided as a plastic leadless chip carrier. Slots provided between the die attach pad and the ground ring provides support and prevent delamination from the plastic molding compound and enhanced moisture-resistance, thus resulting in a highly reliable integrated circuit package, even in the face of high temperature cycles, such as solder reflows.
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