Package for a semiconductor device comprising a plurality of interconnection patterns around a semiconductor chip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 8, 2003
Grant Date -
N/A
app pub date -
Mar 8, 2000
filing date -
Mar 12, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A first interconnection pattern having a comb shape is formed around a semiconductor chip on a package body. A second interconnection pattern having a comb shape is formed around the first interconnection pattern. The projections of the first interconnection pattern are engaged with the projections of the second interconnection pattern. The distances between those two groups of projections and the bonding pads of the semiconductor chip are set nearly equal to each other.
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