Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
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United States of America Patent
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Apr 8, 2003
Grant Date -
Aug 29, 2002
app pub date -
Apr 25, 2002
filing date -
Feb 5, 1998
priority date (Note) -
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Abstract
An encapsulant molding technique used in chip-on-board encapsulation wherein an oxidizable metal layer is patterned on a substrate and the oxidizable metal layer is oxidized to facilitate removal of unwanted encapsulant material. The oxidizable metal layer which adheres to the substrate is applied over a specific portion of the substrate. The oxidizable metal layer is oxidized to form a metal oxide layer which does not adhere to encapsulant materials.
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