Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board

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United States of America Patent

PATENT NO 6546624
APP PUB NO 20020029906A1
SERIAL NO

09734593

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.

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Patent Owner(s)

Patent OwnerAddress
MATSUSHITA ELECTRIC INDUSTRIAL CO LTDOSAKA JAPAN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Andoh, Daizo Osaka, JP 14 186
Echigo, Fumio Osaka, JP 41 452
Fukuda, Noritake Tokyo, JP 3 11
Higashitani, Hideki Kyoto, JP 21 238
Nakamura, Tadashi Osaka, JP 346 4075
Nakatani, Yasuhiro Osaka, JP 28 322

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