Socket apparatus particularly adapted for land grid array type semiconductor devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 15, 2003
Grant Date -
Mar 27, 2003
app pub date -
Sep 24, 2001
filing date -
Sep 24, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A socket (10) has a cover (14) pivotably mounted to a base (12). The base is formed with a seat (12a) for mounting a semiconductor device on a contact mounting plate (18). A locking mechanism (20) for locking the cover in the closed position includes an over center linkage mechanism interacting with a locking pin (20a). In a modified embodiment, the locking mechanism is provided with a pivotable locking member (27) to provide either manual or automated operation. The cover (14) of socket (10) also comprises an integrally formed heat sink. In another embodiment (10'), a separate heat sink (30) is independently mounted on the cover (28) provided with an aperture through the cover in which the heat sink is slidably mounted.
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