Commercial plating of nanolaminates
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United States of America Patent
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Apr 15, 2003
Grant Date -
Jun 13, 2002
app pub date -
Dec 8, 2000
filing date -
Dec 8, 2000
priority date (Note) -
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Abstract
A method for forming a nanolaminate structure is provided which comprises plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic plating process and controlling the plating current to obtain a desired current density at the cathode, which is maintained within a predefined range.
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