US Patent No: 6,548,115
Number of patents in Portfolio can not be more than 2000
System and method for providing coating of substrates
Stats
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Apr 15, 2003
Issued date -
Nov 30, 1998
filing date -
09/201,543
serial no -
In Force
status
Importance
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Abstract
A modular coating apparatus is disclosed which is adapted to couple to a host system, such as a cluster or in-line type coating system, as well as to operate in stand-alone fashion. The coating apparatus uses extrusion to initially deposit a film having a desired thickness. The substrate upon which the film is deposited may be spun to further distribute the film. Various embodiments of the coating apparatus are disclosed including embodiments utilizing a shim to mask the substrate and embodiments utilizing a rotatable chuck to facilitate cleaning of the substrate and/or the chuck. Preferably the various embodiments are sub-modules which may be interchanged in the main module as desired.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 5,608,943 Apparatus for removing process liquid | 112 | 1994 | |
| 5,772,764 Coating apparatus | 45 | 1996 | |
| 5,919,520 Coating method and apparatus for semiconductor process | 56 | 1997 | |
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| 5,779,799 Substrate coating apparatus | 64 | 1996 | |
| 5,952,050 Chemical dispensing system for semiconductor wafer processing | 50 | 1997 | |
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| 6,013,315 Dispense nozzle design and dispense method | 10 | 1998 | |
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| 7,142,439 Zero-voltage-switching single-switched resonant DC link with minimized conduction loss | 3 | 2003 | |
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| 5,489,337 Apparatus for applying organic material to semiconductor wafer in which the nozzle opening adjusts in response to data | 20 | 1994 | |
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| 4,692,351 Method and apparatus for drawing a thick film circuit | 22 | 1985 | |
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| 4,875,434 Apparatus for coating a substrate with a coating material | 17 | 1988 | |
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| 5,415,717 Method and apparatus for depositing particles on a moving web of material | 49 | 1993 | |
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| 5,688,411 Method of and apparatus for removing coating from edge of substrate | 12 | 1996 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 15, 2014 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |